A System in Package Based on a Piezoelectric Micromachined Ultrasonic Transducer Matrix for Ranging Applications

Sensors, Vol. 21 (2021)

Mots clés
Auteurs
  • Alexandre Robichaud
  • Department of Applied Sciences, Université du Québec à Chicoutimi (UQAC), Chicoutimi, QC G7H 2B1, Canada
  • Dominic Deslandes
  • Department of Electrical Engineering, École de Technologie Supérieure (ETS), Montreal, QC H3C 1K3, Canada
  • Paul-Vahé Cicek
  • Department of Computer Sciences, Université du Québec à Montréal (UQAM), Montreal, QC H2X 3Y7, Canada
  • Frederic Nabki
  • Department of Electrical Engineering, École de Technologie Supérieure (ETS), Montreal, QC H3C 1K3, Canada

Résumé

This paper proposes a system in package (SiP) for ultrasonic ranging composed of a 4 × 8 matrix of piezoelectric micromachined ultrasonic transducers (PMUT) and an interface integrated circuit (IC). The PMUT matrix is fabricated using the PiezoMUMPS process and the IC is implemented in the AMS 0.35 µm technology. Simulation results for the PMUT are compared to the measurement results, and an equivalent circuit has been derived to allow a better approximation of the load of the PMUT on the IC. The control circuit is composed of a high-voltage pulser to drive the PMUT for transmission and of a transimpedance amplifier to amplify the received echo. The working frequency of the system is 1.5 MHz.

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